Overview and Purpose Core Function: Safely removes stubborn flux, adhesive residue, fingerprint oils, and dust from sensitive electronics.  Material: Made of open-cell melamine foam structured with ultra-fine nano-particles that lift dirt physically like microscopic sandpaper.  Key Benefit: Cleans efficiently without shedding fibers, fluff, or leaving residue behind, preventing contamination of internal components. Common Applications Motherboards & IC Chips: Wiping off excess soldering flux, paste, or grime during board-level repair. Camera Modules: Cleaning delicate smartphone camera lenses and sensor housings gently without scratching. Screen & Glass Repair: Preparing front screens and back cover glass surfaces during OCA bonding or adhesive replacement. Usage Tips Solvent Compatibility: Can be used dry or lightly dampened with Isopropyl Alcohol (IPA) to quickly dissolve tough oils and glue residues.  Pressure: Apply minimal, gentle pressure since melamine is physically abrasive and can wear down anti-reflective coatings if scrubbed too hard.